Thomas E Noll

Title: Thomas E Noll: Innovator in Semiconductor Packaging

Introduction

Thomas E Noll is a prominent inventor based in Aliso Viejo, CA (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative methods that enhance the integration of active and passive devices in electronic components.

Latest Patents

One of Noll's latest patents is titled "3-D stacking of active devices over passive devices." This invention involves single-die or multi-die packaged modules that utilize three-dimensional integration of active devices with discrete passive devices. The design allows active devices, such as silicon or gallium-arsenide devices, to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.

Another notable patent is "Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding." This exemplary embodiment describes an overmolded package that includes a component situated on a substrate, with an overmold situated over both the component and the substrate. The package features a wirebond cage that surrounds the component and includes several wirebonds, forming an EMI shield around the component. Additionally, a conductive layer situated on the top surface of the overmold connects to the wirebond cage, providing further EMI shielding.

Career Highlights

Thomas E Noll is currently employed at Skyworks Solutions, Inc., where he continues to innovate in the semiconductor industry. His work has significantly impacted the design and functionality of electronic devices, making them more efficient and compact.

Collaborations

Throughout his career, Noll has collaborated with notable colleagues, including Robert W Warren and Anthony James Lobianco. These partnerships have contributed to the advancement of technology in the semiconductor field.

Conclusion

Thomas E Noll is a key figure in the realm of semiconductor packaging, with a focus on innovative solutions that enhance device integration. His contributions through patents and collaborations continue to shape the future of electronic components.