The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Dec. 16, 2010
Dinphuoc V. Hoang, Stanton, CA (US);
Thomas E. Noll, Aliso Viejo, CA (US);
Anil K. Agarwal, Ladera Ranch, CA (US);
Robert W. Warren, Newport Beach, CA (US);
Matthew S. Read, Santa Margarita, CA (US);
Anthony Lobianco, Irvine, CA (US);
Dinphuoc V. Hoang, Stanton, CA (US);
Thomas E. Noll, Aliso Viejo, CA (US);
Anil K. Agarwal, Ladera Ranch, CA (US);
Robert W. Warren, Newport Beach, CA (US);
Matthew S. Read, Santa Margarita, CA (US);
Anthony LoBianco, Irvine, CA (US);
Skyworks Solutions, Inc., Woburn, MA (US);
Abstract
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.