Stanton, CA, United States of America

Dinphuoc V Hoang


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 111(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: **Dinphuoc V Hoang: Innovator in Overmolded Semiconductor Packaging**

Introduction

Dinphuoc V Hoang is a notable inventor based in Stanton, CA, specializing in the field of semiconductor packaging. With a keen understanding of electronic components, he currently holds one patent that enhances the design and functionality of semiconductor packages. His innovative work is linked to Skyworks Solutions, Inc., a leading company in the semiconductor market.

Latest Patents

Dinphuoc's patent, titled "Overmolded semiconductor package with a wirebond cage for EMI shielding," introduces an advanced method for protecting components within semiconductor devices. According to the specifics of this patent, the overmolded package includes a component situated on a substrate. It features an overmold encasing the component and substrate, as well as a wirebond cage that not only surrounds the component but also provides essential electromagnetic interference (EMI) shielding. This innovative design incorporates a conductive layer on the top surface of the overmold, which enhances the shielding efficiency.

Career Highlights

Dinphuoc V Hoang's career at Skyworks Solutions, Inc. has been marked by his expertise in semiconductor technologies. His significant contributions have propelled advancements in the packaging of electronic components, showcasing his dedication to innovation and improvement in the field.

Collaborations

Throughout his career, Dinphuoc has collaborated with notable professionals in the industry, including Thomas E. Noll and Anil K. Agarwal. Together, they have worked on projects that further the development of semiconductor technology, illuminating the importance of teamwork in achieving groundbreaking innovations.

Conclusion

Dinphuoc V Hoang stands out as a prominent inventor in the realm of semiconductor packaging. His patented design demonstrates a sophisticated approach to EMI shielding, showcasing his commitment to enhancing electronic device performance. His work at Skyworks Solutions, Inc. and collaborations with industry peers highlight his integral role in driving innovation within the semiconductor sector.

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