Skyworks Solutions, Inc.

Thomas E Noll

Anthony James Lobianco

Robert W Warren

Matthew Sean Read

Anil K Agarwal

Dinhphuoc Vu Hoang

Howard E Chen

Mark A Kuhlman

Dinphuoc V Hoang

Gye-An Lee

Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.

3-D stacking of active devices over passive devices

According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

Overmolded semiconductor package with wirebonds for electromagnetic shielding

Overmolded semiconductor package with a wirebond cage for EMI shielding

According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound.

Overmolded semiconductor package with an integrated antenna

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Aliso Viejo, CA, United States of America

Thomas E Noll