The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Sep. 27, 2013
Applicant:

Conexant Systems, Inc., Irvine, CA (US);

Inventors:

Robert W. Warren, Newport Beach, CA (US);

Hyun Jane Lee, Aliso Viejo, CA (US);

Nic Rossi, Causeway Bay, HK;

Assignee:

CONEXANT SYSTEMS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/78 (2013.01); H01L 23/49541 (2013.01); H01L 21/568 (2013.01); H01L 23/49582 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/30107 (2013.01);
Abstract

There are provided semiconductor packages having corner pins and methods for their fabrication. Such a semiconductor package includes a leadframe and a die paddle, the leadframe having first and second edge sides meeting to form a first corner. The semiconductor package also includes edge pins arrayed substantially parallel to the first edge side and edge pins arrayed substantially parallel to the second edge side. In addition, the semiconductor package includes a first corner pin situated at the first corner, the first corner pin being electrically isolated from the die paddle.


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