Hong Kong, China

Nic Rossi


Average Co-Inventor Count = 2.4

ph-index = 3

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2013-2016

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6 patents (USPTO):Explore Patents

Title: Innovations by Nic Rossi: A Look at His Contributions to Semiconductor Packaging

Introduction

Nic Rossi is an accomplished inventor based in Hong Kong, China, with a significant portfolio of six patents to his name. His innovations primarily focus on advancements in semiconductor packaging technology, which play a critical role in modern electronic devices. As a key figure at Conexant Systems, Inc., Rossi's contributions are paving the way for enhanced performance in the electronics industry.

Latest Patents

Among Rossi's most notable inventions is the patent for a "Spot plated leadframe and IC bond pad via array design for copper wire." This innovative system enhances the reliability and performance of semiconductor packages by integrating a leadframe with a pre-plated finish and spot plating, designed specifically for copper wire bonding. The invention also features a corner via array design under the bond pad that improves overall package performance, offering several advantages such as high Moisture Sensitivity Level (MSL) ratings and reduced assembly cycles compared to conventional methods using gold wire bonds.

Another significant patent documented by Rossi is related to the "Semiconductor package with corner pins." This design incorporates edge pins arrayed parallel to the leadframe sides, with a unique corner pin that is electrically isolated from the die paddle. This innovation represents a step forward in the fabrication of semiconductor packages, enabling better connectivity and performance in electronic applications.

Career Highlights

During his career at Conexant Systems, Inc., Nic Rossi has established a reputation as an inventive leader in the semiconductor field. His six patents reflect a commitment to solving complex challenges in semiconductor packaging, contributing to the advancement of technologies that power electronics found in various applications.

Collaborations

Rossi has collaborated with esteemed colleagues, including Robert W. Warren and Hyun Jung Lee. Together, they have worked on projects that leverage their collective expertise in engineering, leading to the successful development of innovative solutions within the semiconductor industry.

Conclusion

Nic Rossi's contributions to semiconductor technology through his innovative patents have made a significant impact on the electronics sector. His continuous efforts to improve semiconductor packaging, along with valuable collaborations, position him as a vital player in the ongoing evolution of electronic devices. As technology progresses, inventors like Rossi are essential for driving forward new innovations that enhance the functionality and reliability of everyday electronics.

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