The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Feb. 03, 2009
Applicant:
Robert W Warren, Newport Beach, CA (US);
Inventor:
Robert W Warren, Newport Beach, CA (US);
Assignee:
Conexant Systems, Inc., Newport Beach, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active functional die and a thermal adhesive is used to bond an internal heat spreader to the dummy die. This provides a direct and relatively low thermal conductivity path from the heat source, i.e., the functional device to the top of the package, that is, the internal metal heat spreader which is also exposed to the air.