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For the Inventor, By the Inventor

Portland, OR, United States of America

Richard E Schenker

This inventor holds 62 USPTO granted patents and 21 published patent applications and 8 EPO patents, primarily in Integrated Circuit Design (CPC class H01L). Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard E Schenker. Retrieved from https://idiyas.com/inventor/richard-e-schenker

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 62 

% Patents Active = 82.3

 

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 214(Granted Patents)

Forward Citations (Not Self Cited) = 172(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • San Jose, CA (US) (2002)
  • Portland, OR (US) (2000 - 2024)

Company Filing History:

goldMedal61 out of 56,290 
 
Intel Corporation
 patents
silverMedal1 out of 85 
 
Tahoe Research, Ltd.
 patents

Years Active: 2000-2026

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Areas of Expertise:
Integrated Circuit
Lithography
Self-Assembly
Interconnects
Transistors
Metallization
Patterning
Dielectric
Back End of Line
Gate Structures
Conductive Vias
Microelectronics
62 patents (USPTO):Explore Patents
1. 12757708 - Integrated circuit (IC) device with hybrid metal layer (2026-10-06),
2. 12690257 - Stacked source or drain contact flyover (2026-07-21),
3. 12666950 - Metal routing that overlaps NMOS and PMOS regions of a transistor (2026-06-23),
4. 12604531 - Standard cell architecture without power delivery space allocation (2026-04-14),
5. 12506059 - Vertically spaced intra-level interconnect line metallization for integrated circuit devices (2025-12-23),
6. 12293913 - Directed self-assembly enabled subtractive metal patterning (2025-05-06),
7. 12237223 - Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication (2025-02-25),
8. 12218052 - Advanced lithography and self-assembled devices (2025-02-04),
9. 12154855 - Self-aligned patterning with colored blocking and structures resulting therefrom (2024-11-26),
10. 12087836 - Contact over active gate structures with metal oxide-caped contacts to inhibit shorting (2024-09-10),
11. 12087594 - Colored gratings in microelectronic structures (2024-09-10),
12. 12080639 - Contact over active gate structures with metal oxide layers to inhibit shorting (2024-09-03),
13. 12080605 - Backside contacts for semiconductor devices (2024-09-03),
14. 12012473 - Directed self-assembly structures and techniques (2024-06-18),
15. 11996411 - Stacked forksheet transistors (2024-05-28),

Title: The Innovative Mind of Richard E. Schenker

Introduction:

Richard E. Schenker is a renowned inventor based in Portland, Oregon, known for his groundbreaking contributions to various fields through his inventive spirit and dedication to innovation.

Latest Patents:

Richard E. Schenker holds several patents in diverse areas such as renewable energy technologies, sustainable agriculture solutions, and advanced medical devices, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Richard E. Schenker has established himself as a pioneer in the world of inventions, with numerous successful products that have positively impacted industries and people's lives globally.

Collaborations:

Throughout his career, Richard E. Schenker has collaborated with leading research institutions, universities, and innovative companies to bring his ideas to life, fostering a culture of creativity and progress in the field of inventions.

Conclusion:

In conclusion, Richard E. Schenker's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true visionary in the world of inventions, with a legacy that continues to inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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