The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Sep. 16, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

June Choi, Portland, OR (US);

Charles Henry Wallace, Portland, OR (US);

Richard E. Schenker, Portland, OR (US);

Nikhil Jasvant Mehta, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/00 (2026.01); H10W 20/41 (2026.01); H10W 20/44 (2026.01);
U.S. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/056 (2026.01); H10W 20/089 (2026.01); H10W 20/435 (2026.01); H10W 20/4403 (2026.01); H10W 20/4421 (2026.01); H10W 20/4432 (2026.01);
Abstract

An IC device includes a transistor, a first layer, and a second layer. The first layer is coupled to the transistors and is between the transistor and the second layer in a first direction. The first layer includes a first structure and a second structure. The first structure includes a first metal (e.g., Ru). The second structure includes a second metal (e.g., Cu). The second structure may be wrapped around by a different material that may include a third metal (e.g., Co). The first structure may be shorter than the second structure in the first direction and narrower than the second structure in a second direction orthogonal to the first direction. The first structure may be closer to the second layer than the second structure in the first direction. The first structure may be a wordline of a memory. The second structure may be a bitline.


Find Patent Forward Citations

Choi, June. (2026). Integrated circuit (ic) device with hybrid metal layer (U.S. Patent No. 12757708). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757708

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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