Rahul Kumar Agarwal

This inventor holds 91 USPTO granted patents and 41 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Advanced Micro Devices Corporation, Palantir Technologies Inc., Microsoft Technology Licensing, LLC. Active years: 2016-2026.

USPTO Granted Patents = 91 (Patent Applications = 41)

% Patents Active = 97.8

EPO Patents = 2 (Patent Applications = 20)

Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 319(Granted Patents)

Forward Citations (Not Self Cited) = 221(Dec 10, 2025)

Inventors with similar research interests:

Location History:

San Jose, CA (US) (2017 - 2021)
New York City, NY (US) (2019 - 2021)
Saratoga, CA (US) (2020 - 2021)
Broomfield, CO (US) (2021)
Hyderabad, IN (2021)
Los Angeles, CA (US) (2021 - 2022)
Sunnyvale, CA (US) (2017 - 2023)
Livermore, CA (US) (2019 - 2023)
San Francisco, CA (US) (2016 - 2024)
New York, NY (US) (2019 - 2024)
Palo Alto, CA (US) (2020 - 2024)
Santa Clara, CA (US) (2022 - 2024)

Company Filing History:

53 out of 13,157

Advanced Micro Devices Corporation

patents

15 out of 1,708

Palantir Technologies Inc.

patents

6 out of 56,194

Microsoft Technology Licensing, LLC

International Business Machines Corporation

Megachips Technology America Corporation

13. 1 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 2016-2026

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Areas of Expertise:

Hybrid Bonding

3D Integration

Chiplet Design

Thermal Management

Wafer Processing

Photonic Integrated Circuit

Voltage Regulator

High-Speed Connections

Data Clustering

Active-Bridge-Coupled

Fraud Detection

Interconnects

91 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12690487 - Embedding an electronic component in a core of an integrated circuit substrate (2026-07-21),

2. 12666713 - Double side transistors on same silicon wafer (2026-06-23),

3. 12635536 - Apparatuses and methods for bridge-based packaging with direct power delivery (2026-05-19),

4. 12588486 - Connecting semicondcutor device assembly components using interconnect dies with spacer component coupled to a portion of an interconnect die (2026-03-24),

5. 12530361 - Generation of reasoning for asset rankings (2026-01-20),

6. 12525573 - Partitioning wafer processing and hybrid bonding of layers formed on different wafers for a semiconductor assembly (2026-01-13),

7. 12519085 - Direct cooling for SoIC architectures (2026-01-06),

8. 12517571 - Generative artificial intelligence system for creating movement in a physical environment (2026-01-06),

9. 12512371 - Wafer-level testing of fanout chiplets (2025-12-30),

10. 12430346 - Systems and methods for automatic clustering and canonical designation of related data in various data structures (2025-09-30),

11. 12424560 - Semiconductor chip device (2025-09-23),

12. 12394683 - Molded semiconductor chip package with stair-step molding layer (2025-08-19),

13. 12390170 - Methods and systems for controlling a left ventricular assist device (2025-08-19),

14. 12381127 - Semiconductor chip device integrating thermal pipes in three-dimensional packaging (2025-08-05),

15. 12334488 - Stacking power delivery device dies (2025-06-17),

Certainly! Here is the article about inventor Rahul Kumar Agarwal based on the given data:

Title: Innovator Spotlight: Rahul Kumar Agarwal

Introduction:

Rahul Kumar Agarwal is a prolific inventor based in Saratoga, California. With an impressive portfolio of 54 patents, he continues to push the boundaries of technology and innovation in the realm of integrated circuits.

Latest Patents:

1. Offset-aligned three-dimensional integrated circuit: Rahul's groundbreaking invention enhances the efficiency of three-dimensional integrated circuits by optimizing power density distribution across different regions.

2. GPU chiplets using high bandwidth crosslinks: This patent revolutionizes chiplet systems by introducing passive crosslinks that enable seamless communication between chiplets, leading to more efficient system-on-a-chip functionality.

Career Highlights:

Rahul Kumar Agarwal has made significant contributions to renowned companies in the tech industry, including Advanced Micro Devices (AMD) and Palantir Technologies Inc.. His expertise and innovative spirit have been essential in driving advancements in semiconductor technology and system integration.

Collaborations:

Throughout his career, Rahul has collaborated with esteemed professionals such as Milind S Bhagavat and Brett P Wilkerson. Together, they have pushed the boundaries of technology and paved the way for groundbreaking innovations in the field of integrated circuits.

Conclusion:

Rahul Kumar Agarwal's dedication to innovation and his exemplary track record in patenting cutting-edge technologies make him a trailblazer in the world of integrated circuits. His contributions have not only shaped the industry but have also laid the foundation for future advancements in semiconductor technology.

I hope this article provides valuable insights into the remarkable work of inventor Rahul Kumar Agarwal.