The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Dec. 28, 2021
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
Rahul Agarwal, Santa Clara, CA (US);
Raja Swaminathan, Austin, TX (US);
John Wuu, Fort Collins, CO (US);
Mihir Pandya, Austin, TX (US);
Samuel D. Naffziger, Fort Collins, CO (US);
Assignee:
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10P 72/00 (2026.01); H10P 72/70 (2026.01); H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 20/20 (2026.01); H10W 90/00 (2026.01);
Abstract
A chip for multi-die communications couplings using a single bridge die, includes: a plurality of dies each including one or more functional circuit blocks; and a first bridge die directly communicatively coupling two or more pairs of dies of the plurality of dies.
Agarwal, Rahul. (2026). Multi-die communications couplings using a single bridge die (U.S. Patent No. 12772876). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772876
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile