This inventor holds 1 USPTO granted patent. Top assignee: Advanced Micro Devices Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Mihir Pandya and Multi-Die Communications
Introduction
Mihir Pandya is an inventor based in Austin, Texas, whose patent work includes semiconductor technology for communication between multiple dies. His disclosed invention addresses how dies can be connected efficiently within a chip.
Latest Patents
Pandya is associated with 1 patent: “Multi-die communications couplings using a single bridge die.” The invention describes a chip containing multiple dies, each with one or more functional circuit blocks, and a bridge die that directly communicatively couples two or more pairs of those dies.
Career Highlights
Pandya’s patent is assigned to Advanced Micro Devices Corporation. It focuses on a single-bridge-die approach to communications among multiple dies, a design intended to support connections within complex semiconductor packages.
Collaborations
Pandya’s listed coworkers include Rahul Agarwal and Raja Swaminathan. Their shared association reflects the collaborative environment in which semiconductor inventions are developed and patented.
Conclusion
Mihir Pandya’s patent highlights an approach to multi-die chip communication using a single bridge die, contributing to the portfolio of semiconductor inventions associated with Advanced Micro Devices Corporation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile