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For the Inventor, By the Inventor

Austin, TX, United States of America

Edward Outlaw Travis, Jr

This inventor holds 59 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Design (CPC class H01L). Top assignees: Freescale Semiconductor,inc., Motorola Corporation, Nxp USA, Inc.. Active years: 1993-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Edward Outlaw Travis, Jr. Retrieved from https://idiyas.com/inventor/edward-outlaw-travis-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 59 

% Patents Active = 69.5

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 375(Granted Patents)

Forward Citations (Not Self Cited) = 339(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal44 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal11 out of 20,290 
 
Motorola Corporation
 patents
bronzeMedal3 out of 2,854 
 
Nxp USA, Inc.
 patents
4. 1 out of 10 
 
Amd Inc.
 patents
5. 1 out of 834,570 
Other
 patents
where one patent can have more than one assignee

Years Active: 1993-2018

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Areas of Expertise:
Electromigration Management
3D Device Packaging
Stress Migration Mitigation
Semiconductor Devices
Integrated Circuit Design
Heat Dissipation
Via Placement
Epitaxial Growth
Electrical Connections
Device Matching
Teleconferencing Technology
Circuit Element Libraries
59 patents (USPTO):Explore Patents
1. 10014257 - Apparatus and method for placing stressors within an integrated circuit device to manage electromigration failures (2018-07-03),
2. 9685405 - Fuse/resistor utilizing interconnect and vias and method of making (2017-06-20),
3. 9652577 - Integrated circuit design using pre-marked circuit element object library (2017-05-16),
4. 9515006 - 3D device packaging using through-substrate posts (2016-12-06),
5. 9508702 - 3D device packaging using through-substrate posts (2016-11-29),
6. 9508701 - 3D device packaging using through-substrate pillars (2016-11-29),
7. 9455220 - Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures (2016-09-27),
8. 9445050 - Teleconferencing environment having auditory and visual cues (2016-09-13),
9. 9443804 - Capping layer interface interruption for stress migration mitigation (2016-09-13),
10. 9318409 - Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit (2016-04-19),
11. 9245817 - Semiconductor device with embedded heat spreading (2016-01-26),
12. 9236344 - Thin beam deposited fuse (2016-01-12),
13. 9142507 - Stress migration mitigation utilizing induced stress effects in metal trace of integrated circuit device (2015-09-22),
14. 9122829 - Stress migration mitigation (2015-09-01),
15. 9122812 - Semiconductor device with vias on a bridge connecting two buses (2015-09-01),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can help you with that. Let's begin with the article about inventor Edward Outlaw Travis, Jr.

Title: Spotlight on Edward Outlaw Travis, Jr: Pioneering Innovations in Integrated Circuits

Introduction:

Edward Outlaw Travis, Jr., a distinguished inventor based in Austin, TX, has made significant contributions to the field of integrated circuits. With an impressive portfolio of 59 patents to his name, Travis is known for his groundbreaking work in managing electromigration failures and semiconductor structures.

Latest Patents:

1. Apparatus and Method for Placing Stressors within an Integrated Circuit Device: Travis's innovative approach involves incorporating stressors within integrated circuit devices to enhance their reliability and performance.

2. Fuse/Resistor Utilizing Interconnect and Vias: His semiconductor structure design integrates fuse/resistor structures over functional layers, showcasing his expertise in optimizing circuit functionality.

Career Highlights:

Edward Outlaw Travis, Jr. has held key roles at reputable companies such as Freescale Semiconductor, Inc. and Motorola Corporation. His expertise and innovative solutions have left a lasting impact on the semiconductor industry.

Collaborations:

Throughout his career, Travis has collaborated with esteemed professionals in the field, including Mehul D Shroff and Douglas Michael Reber. These collaborations have led to the development of cutting-edge technologies and solutions.

Conclusion:

In conclusion, Edward Outlaw Travis, Jr. stands out as a visionary inventor who continues to push the boundaries of innovation in integrated circuits. His relentless pursuit of excellence and collaborative spirit underscore his contributions to the field, shaping the future of semiconductor technology.

If you need more information or assistance, feel free to ask!

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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