The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Jun. 12, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Douglas M. Reber, Austin, TX (US);
Mehul D. Shroff, Austin, TX (US);
Edward O. Travis, Austin, TX (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A method for 3D device packaging utilizes through-hole metal post techniques to mechanically and electrically bond two or more dice. The first die includes a set of through-holes extending from a first surface of the first die to a second surface of the first die. The second die includes a third surface and a set of metal posts. The first die and the second die are stacked such that the third surface of the second die faces the second surface of the first die, and each metal post extends through a corresponding through-hole to a point beyond the first surface of the first die, electrically coupling the first die and the second die.