The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jun. 12, 2023
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Jon Thomas Woodyard, Livermore, CA (US);

Rahul Agarwal, Livermore, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H10W 70/63 (2026.01); H10W 70/68 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10W 74/114 (2026.01); H10W 70/635 (2026.01); H10W 70/6875 (2026.01); H10W 90/00 (2026.01); H10D 1/68 (2025.01);
Abstract

Examples are provided that relate to embedding, in a core of a substrate, an electronic component having a thickness less than a thickness of the core. One example provides an electronic device comprising a substrate comprising a core and one or more buildup layers coupled with the core, each buildup layer comprising a metal layer and a dielectric layer. The core comprises a center comprising a plurality of plies, and an additional layer comprising one or more additional plies. The electronic device further comprises an electronic component embedded in at least one of the center or the additional layer of the core. The electronic component comprises a thickness less than a thickness of the core. The electronic device further comprises an integrated circuit die coupled with the substrate and electrically connected to the electronic component.


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