Livermore, CA, United States of America

Jon Thomas Woodyard

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Microsoft Technology Licensing, LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jon Thomas Woodyard. Retrieved from https://idiyas.com/inventor/jon-thomas-woodyard

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jon Thomas Woodyard and Integrated Circuit Substrate Innovation.

Introduction

Jon Thomas Woodyard is an inventor associated with Livermore, California, and Microsoft Technology Licensing, LLC. His listed patent concerns embedding an electronic component within the core of an integrated circuit substrate.

Latest Patents

The patent, “Embedding an Electronic Component in a Core of an Integrated Circuit Substrate,” describes ways to embed a component in a substrate core when the component is thinner than the core. The disclosed device includes a core made from multiple plies, one or more buildup layers containing metal and dielectric layers, and an integrated circuit die electrically connected to the embedded component. The component may be placed in the core’s central portion or in an additional layer.

Career Highlights

The provided information identifies Woodyard’s work with Microsoft Technology Licensing, LLC and lists 1 patent. The patent reflects an approach to integrating electronic components into substrate structures while connecting them to an integrated circuit die.

Collaborations

The available information associates Woodyard’s patent work with Microsoft Technology Licensing, LLC. It does not specify additional collaborators or co-inventors.

Conclusion

Jon Thomas Woodyard’s listed invention addresses embedding a thin electronic component within an integrated circuit substrate core, offering a structural approach to component integration and electrical connection.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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