The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Sep. 08, 2022
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Chandra Sekhar Mandalapu, Fort Collins, CO (US);
Rahul Agarwal, Santa Clara, CA (US);
Raja Swaminathan, Austin, TX (US);
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Abstract
The disclosed computer-implemented method for multi-tier multi-die modules may include bonding a front side of a first plurality of dies to a first carrier, forming a first wafer; preparing a back-side surface of the first wafer for hybrid bonding; bonding a back side of a second plurality of dies to a second carrier, forming a second wafer; preparing a front-side surface of the second wafer for hybrid bonding; and hybrid bonding the first wafer with the second wafer. Various other methods, apparatuses, and systems are also disclosed.