Santa Clara, CA, United States of America

Rahul Agarwal

This inventor holds 2 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Advanced Micro Devices Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rahul Agarwal. Retrieved from https://idiyas.com/inventor/rahul-agarwal-d85swzay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 


Average Co-Inventor Count = 2.0


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Innovations of Rahul Agarwal

Introduction

Rahul Agarwal is a prominent inventor based in Santa Clara, CA. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to multi-tier multi-die modules and three-dimensional semiconductor packages.

Latest Patents

One of his latest patents is titled "Systems and methods for multi-tier multi-die modules." This patent describes a computer-implemented method that includes bonding a front side of a first plurality of dies to a first carrier, forming a first wafer. It also involves preparing a back-side surface of the first wafer for hybrid bonding, bonding a back side of a second plurality of dies to a second carrier, and preparing a front-side surface of the second wafer for hybrid bonding. The process culminates in hybrid bonding the first wafer with the second wafer, along with various other methods, apparatuses, and systems.

Another notable patent is "Three-dimensional semiconductor package having a stacked passive device." This assembly includes a die with a plurality of through silicon vias (TSVs). The first TSV supplies power from an active surface of the die to its back surface. Additionally, a passive device is coupled to the back surface of the die, allowing for electrical interfacing with the TSVs. The passive device receives power through the first TSV and supplies it to the first die through the second TSV.

Career Highlights

Rahul Agarwal is currently employed at Advanced Micro Devices Corporation, a leading company in the semiconductor industry. His work focuses on advancing technologies that enhance the performance and efficiency of semiconductor devices.

Collaborations

Throughout his career, Agarwal has collaborated with notable colleagues, including Raja Swaminathan and Chandra Sekhar Mandalapu. These collaborations have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

Rahul Agarwal's contributions to semiconductor technology through his patents and work at Advanced Micro Devices Corporation highlight his role as an influential inventor in the industry. His innovative methods and collaborative efforts continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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