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For the Inventor, By the Inventor

Beaverton, OR, United States of America

Pulkit Agarwal

This inventor holds 28 USPTO granted patents and 18 published patent applications, primarily in Atomic Layer Deposition. Top assignee: Lam Research Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pulkit Agarwal. Retrieved from https://idiyas.com/inventor/pulkit-agarwal

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 92.9

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 101(Granted Patents)


Location History:

  • Hillsboro, OR (US) (2020)
  • Beaverton, OR (US) (2018 - 2024)

Company Filing History:

goldMedal28 out of 3,940 
 
Lam Research Corporation
 patents

Years Active: 2018-2026

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Areas of Expertise:
Atomic Layer Deposition
Critical Dimension Control
Semiconductor Manufacturing
Plasma Enhanced Deposition
Multi-Zone Substrate Support
Temperature Control
Film Uniformity
Patterning Processes
Gap Fill Techniques
Process Optimization
Wafer Centering
Reactor Processing
28 patents (USPTO):Explore Patents
1. 12655516 - Seam mitigation and integrated liner for gap fill (2026-06-16),
2. 12624455 - Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes (2026-05-12),
3. 12531220 - Automated feedforward and feedback sequence for patterning CD control (2026-01-20),
4. 12473633 - Plasma enhanced atomic layer deposition of silicon-containing films (2025-11-18),
5. 12451346 - Modulated atomic layer deposition (2025-10-21),
6. 12322619 - Dynamic process control in semiconductor manufacturing (2025-06-03),
7. 12308264 - Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports (2025-05-20),
8. 12209312 - Temperature control of a multi-zone pedestal (2025-01-28),
9. 12186851 - Use of vacuum during transfer of substrates (2025-01-07),
10. 12071689 - Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes (2024-08-27),
11. 12057300 - Apparatus for cleaning plasma chambers (2024-08-06),
12. 12040181 - Modulated atomic layer deposition (2024-07-16),
13. 11913113 - Method and apparatus for modulating film uniformity (2024-02-27),
14. 11651963 - Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film (2023-05-16),
15. 11542599 - Method and apparatus for providing station to station uniformity (2023-01-03),

Title: Pulkit Agarwal: Innovator from Beaverton

Introduction: Pulkit Agarwal is a renowned inventor based in Beaverton, Oregon, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Pulkit Agarwal holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his expertise in cutting-edge technologies.

Career Highlights: With a background in computer science and engineering, Pulkit Agarwal has worked for leading tech companies, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Pulkit Agarwal has collaborated with top researchers, engineers, and scientists to develop innovative solutions that have had a significant impact on various sectors.

Conclusion: Pulkit Agarwal's passion for innovation and his dedication to pushing the boundaries of technology make him a standout figure in the world of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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