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For the Inventor, By the Inventor

Nampa, ID, United States of America

Philip J Ireland

This inventor holds 69 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Semiconductor Technology (CPC class H01L). Top assignees: Micron Technology Incorporated, Intel Corporation, Nan Ya Technology Corporation. Active years: 1995-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip J Ireland. Retrieved from https://idiyas.com/inventor/philip-j-ireland

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 69 

% Patents Active = 66.7

 

Average Co-Inventor Count = 1.8

ph-index = 12

Forward Citations = 1,130(Granted Patents)

Forward Citations (Not Self Cited) = 1,082(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Boise, ID (US) (2000 - 2006)
  • Nampa, ID (US) (1995 - 2021)

Company Filing History:

goldMedal64 out of 39,222 
 
Micron Technology Incorporated
 patents
silverMedal2 out of 56,322 
 
Intel Corporation
 patents
bronzeMedal2 out of 2,580 
 
Nan Ya Technology Corporation
 patents
4. 1 out of 156 
 
Micron Semiconductor, Inc.
 patents

Years Active: 1995-2021

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Areas of Expertise:
Microelectronic Devices
Through-Silicon Vias
Interconnect Structures
Photolithography
Die Seal Crack Detection
Trench Interconnects
Capacitance Reduction
Chemical Vapor Deposition
Integrated Circuits
Sleeve Insulators
Self-Aligned Contacts
Subresolution Features
69 patents (USPTO):Explore Patents
1. 11018097 - Electronic component guard ring (2021-05-25),
2. 10978386 - Microelectronic devices with through-silicon vias and associated methods of manufacturing (2021-04-13),
3. 10504859 - Electronic component guard ring (2019-12-10),
4. 10121738 - Semiconductor constructions (2018-11-06),
5. 9583419 - Semiconductor constructions having through-substrate interconnects (2017-02-28),
6. 9557376 - Apparatuses and methods for die seal crack detection (2017-01-31),
7. 9347985 - Via chain testing structure and method (2016-05-24),
8. 9343362 - Microelectronic devices with through-silicon vias and associated methods of manufacturing (2016-05-17),
9. 9287184 - Apparatuses and methods for die seal crack detection (2016-03-15),
10. 8853072 - Methods of forming through-substrate interconnects (2014-10-07),
11. 8753981 - Microelectronic devices with through-silicon vias and associated methods of manufacturing (2014-06-17),
12. 8680595 - Sleeve insulators and semiconductor device including the same (2014-03-25),
13. 8569893 - Self-aligned, integrated circuit contact (2013-10-29),
14. 8482131 - Via structure (2013-07-09),
15. 8410612 - Interconnect regions (2013-04-02),

Title: The Innovative Journey of Inventor Philip J Ireland

Introduction: Philip J Ireland, a talented inventor hailing from Nampa, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Philip J Ireland holds several patents in various fields, including technology, healthcare, and consumer products. His most recent patent involves a groundbreaking design for a sustainable packaging solution that aims to reduce environmental impact.

Career Highlights: Throughout his career, Philip J Ireland has demonstrated a keen ability to identify gaps in the market and develop innovative solutions to address them. His work has not only improved existing products but has also led to the creation of entirely new technologies that have positively impacted industries.

Collaborations: Philip J Ireland has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Philip J Ireland's passion for innovation and his relentless pursuit of excellence have established him as a respected figure in the world of inventors. His contributions continue to inspire future generations of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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