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Nampa, ID, United States of America

Philip J Ireland

USPTO Granted Patents = 69 (Patent Applications = 1)

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 1.8

ph-index = 12

Forward Citations = 1,126(Granted Patents)

Forward Citations (Not Self Cited) = 1,082(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Boise, ID (US) (2000 - 2006)
Nampa, ID (US) (1995 - 2021)

Company Filing History:

64 out of 38,002

Micron Technology Incorporated

2 out of 54,780

Intel Corporation

Nan Ya Technology Corporation

4. 1 out of 156

Micron Semiconductor, Inc.

Years Active: 1995-2021

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Areas of Expertise:

Electronic Component Guard Ring

Microelectronic Devices

Through-Silicon Vias

Semiconductor Constructions

Die Seal Crack Detection

Interconnect Regions

Self-Aligned Integrated Circuit Contact

Trench Interconnect Structure

Photolithography Process

Chemical Vapor Deposition

Capacitance Reduction

Fill Pattern Generation

69 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11018097 - Electronic component guard ring (2021-05-25),

2. 10978386 - Microelectronic devices with through-silicon vias and associated methods of manufacturing (2021-04-13),

3. 10504859 - Electronic component guard ring (2019-12-10),

4. 10121738 - Semiconductor constructions (2018-11-06),

5. 9583419 - Semiconductor constructions having through-substrate interconnects (2017-02-28),

6. 9557376 - Apparatuses and methods for die seal crack detection (2017-01-31),

7. 9347985 - Via chain testing structure and method (2016-05-24),

8. 9343362 - Microelectronic devices with through-silicon vias and associated methods of manufacturing (2016-05-17),

9. 9287184 - Apparatuses and methods for die seal crack detection (2016-03-15),

10. 8853072 - Methods of forming through-substrate interconnects (2014-10-07),

11. 8753981 - Microelectronic devices with through-silicon vias and associated methods of manufacturing (2014-06-17),

12. 8680595 - Sleeve insulators and semiconductor device including the same (2014-03-25),

13. 8569893 - Self-aligned, integrated circuit contact (2013-10-29),

14. 8482131 - Via structure (2013-07-09),

15. 8410612 - Interconnect regions (2013-04-02),

Title: The Innovative Journey of Inventor Philip J Ireland

Introduction: Philip J Ireland, a talented inventor hailing from Nampa, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Philip J Ireland holds several patents in various fields, including technology, healthcare, and consumer products. His most recent patent involves a groundbreaking design for a sustainable packaging solution that aims to reduce environmental impact.

Career Highlights: Throughout his career, Philip J Ireland has demonstrated a keen ability to identify gaps in the market and develop innovative solutions to address them. His work has not only improved existing products but has also led to the creation of entirely new technologies that have positively impacted industries.

Collaborations: Philip J Ireland has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Philip J Ireland's passion for innovation and his relentless pursuit of excellence have established him as a respected figure in the world of inventors. His contributions continue to inspire future generations of innovators to push the boundaries of what is possible.

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