The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Aug. 04, 2011
Applicants:
Philip J. Ireland, Nampa, ID (US);
Wen-sung Chiang, Hsinchu, TW;
Inventors:
Philip J. Ireland, Nampa, ID (US);
Wen-Sung Chiang, Hsinchu, TW;
Assignee:
NANYA TECHNOLOGY CORP., Gueishan Dist., Taoyuan, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01K 13/12 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2853 (2013.01); G01R 31/2875 (2013.01); G01R 31/2896 (2013.01);
Abstract
A via chain testing structure includes: a substrate; a dielectric layer disposed on the substrate; a first via chain disposed on dielectric layer; a second via chain, being disposed on the dielectric on both sides of the first via chain and in thermal proximity with the first via chain; a first heating source disposed under the substrate, for providing thermal heat to the first via chain; and an electrical current source for heating the second via chain so the second via chain acts as a second heating source for the first via chain.