Pei-Hsuan Lee

This inventor holds 40 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pei-Hsuan Lee. Retrieved from https://idiyas.com/inventor/pei-hsuan-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 40 (Patent Applications = 1)

% Patents Active = 92.5

Average Co-Inventor Count = 5.4

ph-index = 4

Forward Citations = 41(Granted Patents)

Location History:

Hsinchu, TW (2020)
Tainan, TW (2016 - 2024)
Taipei, TW (2017 - 2024)

Company Filing History:

40 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2016-2026

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Areas of Expertise:

Copper Vias

Integrated Circuit

Wafer-Level Testing

Interconnect Structure

Electronic Device

Selective Capping

Package Structure

Nitrogen Plasma Treatment

Defect Detection

Physical Vapor Deposition

Mechanical Braces

Chip Packages

40 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12543553 - Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes (2026-02-03),

2. 12374595 - Package system and manufacturing method thereof (2025-07-29),

3. 12300571 - Integrated circuit package and method (2025-05-13),

4. 12243218 - Method and system for scanning wafer (2025-03-04),

5. 12176279 - Package structure and manufacturing method thereof (2024-12-24),

6. 12165975 - Method of forming interconnect structure having a barrier layer (2024-12-10),

7. 12159830 - Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect (2024-12-03),

8. 12062832 - Electronic device and manufacturing method thereof (2024-08-13),

9. 12061229 - In-line electrical detection of defects at wafer level (2024-08-13),

10. 12040247 - Package system and manufacturing method thereof (2024-07-16),

11. 11990381 - Integrated circuit packages having support rings (2024-05-21),

12. 11984365 - Semiconductor structure inspection using a high atomic number material (2024-05-14),

13. 11830742 - Selective capping processes and structures formed thereby (2023-11-28),

14. 11791206 - Method for forming semiconductor device (2023-10-17),

15. 11783469 - Method and system for scanning wafer (2023-10-10),

Title: The Innovative Journey of Pei-Hsuan Lee

Introduction:

Pei-Hsuan Lee, a talented inventor hailing from Taipei, TW, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Lee's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation technology.

Career Highlights:

Throughout his illustrious career, Lee has been at the forefront of technological innovation, with a focus on developing sustainable solutions for complex problems. His work has garnered international recognition and praise for its ingenuity and practicality.

Collaborations:

Lee has collaborated with leading research institutions and tech companies to further his research and bring his inventions to life. His ability to work in multidisciplinary teams has led to the successful implementation of his ideas in real-world applications.

Conclusion:

In conclusion, Pei-Hsuan Lee stands as a visionary inventor who continues to push the boundaries of technology and inspire the next generation of innovators. His dedication to creating impactful solutions underscores his status as a true pioneer in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: