The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jul. 22, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Pei-Hsuan Lee, Tainan, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chien-Ling Hwang, Hsinchu, TW;
Yu-Ting Chiu, Hsinchu County, TW;
Jui-Chang Kuo, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01Q 1/40 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4846 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01Q 1/40 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01);
Abstract
A method of manufacturing an electronic device includes providing a core dielectric layer with two conductive layers formed on two opposite surfaces of the core dielectric layer, and removing at least a portion of each of the two conductive layers to respectively form an antenna pattern and a circuit pattern of a chip package at the two opposite surfaces of the core dielectric layer.