Hsinchu, Taiwan

Jui-Chang Kuo

USPTO Granted Patents = 5 

Average Co-Inventor Count = 7.4

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2019-2024

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5 patents (USPTO):Explore Patents

Title: Innovations of Jui-Chang Kuo

Introduction

Jui-Chang Kuo is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic devices, holding a total of five patents. His work focuses on innovative manufacturing methods that enhance the functionality and efficiency of electronic components.

Latest Patents

One of his latest patents is titled "Electronic device and manufacturing method thereof." This patent describes a method of manufacturing an electronic device that involves providing a core dielectric layer with two conductive layers on opposite surfaces. The process includes removing portions of these conductive layers to create an antenna pattern and a circuit pattern for a chip package. Another significant patent is "Integrated fan-out package and manufacturing method thereof." This invention outlines a method for manufacturing an integrated fan-out (InFO) package, which includes forming a package array and stacking a core layer and dielectric layer over it, incorporating cavities and conductive patches.

Career Highlights

Jui-Chang Kuo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic device manufacturing.

Collaborations

Jui-Chang Kuo has collaborated with several talented individuals in his field, including Ching-Hua Hsieh and Chien-Ling Hwang. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Jui-Chang Kuo's contributions to the field of electronic devices through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of electronic manufacturing.

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