Company Filing History:

8 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 112

Worldwide Semiconductor Manufacturing Corporation

patents

Years Active: 2001-2012

where 'Filed Patents' based on already Granted Patents

11 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8217520 - System-in-package packaging for minimizing bond wire contamination and yield loss (2012-07-10),

2. 7843058 - Flip chip packages with spacers separating heat sinks and substrates (2010-11-30),

3. 7719122 - System-in-package packaging for minimizing bond wire contamination and yield loss (2010-05-18),

4. 7679180 - Bond pad design to minimize dielectric cracking (2010-03-16),

5. 7659632 - Solder bump structure and method of manufacturing same (2010-02-09),

6. 7602065 - Seal ring in semiconductor device (2009-10-13),

7. 7446398 - Bump pattern design for flip chip semiconductor package (2008-11-04),

8. 7148574 - Bonding pad structure and method of forming the same (2006-12-12),

9. 6630051 - Auto slurry deliver fine-tune systems for chemical-mechanical-polishing process and method of using the system (2003-10-07),

10. 6410441 - Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system (2002-06-25),

11. 6277751 - Method of planarization (2001-08-21),

Title: Pao-Kang Niu: Innovator in Semiconductor Packaging

Introduction

Pao-Kang Niu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His work focuses on innovative solutions that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Among his latest patents is a groundbreaking system-in-package (SiP) packaging designed to minimize bond wire contamination and yield loss. This SiP package features a substrate with bond wire studs on bond pads, a first semiconductor chip mounted via solder bumps, and an underfill material encapsulating the solder bumps. Additionally, it includes a second semiconductor chip mounted on the first, with bond wires connecting the two. Another notable patent involves flip chip packages that utilize spacers to separate heat sinks from substrates, improving thermal management in semiconductor devices.

Career Highlights

Pao-Kang Niu has worked with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company and Worldwide Semiconductor Manufacturing Corporation. His experience in these organizations has allowed him to develop and refine his innovative packaging solutions.

Collaborations

Throughout his career, Niu has collaborated with notable colleagues such as Pei-Haw Tsao and Liang-Chen Lin. These partnerships have contributed to the advancement of semiconductor technology and the successful implementation of his patented inventions.

Conclusion

Pao-Kang Niu's contributions to semiconductor packaging have established him as a key figure in the industry. His innovative patents continue to influence the development of more efficient and reliable semiconductor devices.

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