The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Apr. 14, 2004
Jian-hsing Lee, Pu-Tzu, TW;
Pao-kang Niu, Hsinchu, TW;
Ko-yi Lee, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A bonding pad structure and fabrication method thereof. A bonding pad is substantially surrounded and insulated by a dielectric layer, wherein the bonding pad is formed of at least one first conductive layer having a wiring layer with a stripe layout and a first edge portion, a second conductive layer having a wire bonding portion and a second edge portion and a plurality of plugs electrically connecting the wiring layer and the wire bonding portion. A conductive structure of an array of metal plugs or a metal damascene structure is formed to connect the first edge portion and the second edge portion, thereby preventing burn out of the first edge portion during an ESD event.