The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2009

Filed:

Mar. 05, 2008
Applicants:

Shang-yun Hou, Jubei, TW;

Chun-hung Chen, Jhubei, TW;

Chia-lun Tsai, Hsinchu, TW;

Pao-kang Niu, Hsinchu, TW;

Shin-puu Jeng, Hsinchu, TW;

Inventors:

Shang-Yun Hou, Jubei, TW;

Chun-Hung Chen, Jhubei, TW;

Chia-Lun Tsai, Hsinchu, TW;

Pao-Kang Niu, Hsinchu, TW;

Shin-Puu Jeng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a first circuit, a first seal ring and at least one first notch. The first seal ring surrounds the first circuit. The first notch cuts the first seal ring. Specifically, the first notch includes an inner opening, an outer opening and a connecting groove. The inner opening is located on the inner side of the first seal ring. The outer opening is located on the outer side of the first seal ring. The outer opening and the inner opening are not aligned. The connecting groove connects the inner opening and the outer opening.


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