Kawasaki, Japan

Naoki Watanabe



Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 23(Granted Patents)


Location History:

  • Sapporo, JP (2013)
  • Kawasaki, JP (1991 - 2019)

Company Filing History:


Years Active: 1991-2019

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10 patents (USPTO):Explore Patents

Title: Naoki Watanabe: Innovator in Sputtering Technology

Introduction

Naoki Watanabe is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of sputtering technology, holding a total of 10 patents. His work focuses on enhancing the uniformity and efficiency of deposition processes in various applications.

Latest Patents

Watanabe's latest patents include a sputtering apparatus and a recording medium for recording control programs. The sputtering apparatus features a target that is offset with respect to a substrate, ensuring uniform deposition even at low rotational speeds. This innovation allows for film thicknesses of 1 nm or less. Another notable patent describes a sputtering device and method that forms a magnetic film with excellent uniformity in film thickness and sheet resistance. This is achieved by applying a magnetic field on the substrate's processing surface and utilizing oblique incidence sputtering with high discharge power.

Career Highlights

Throughout his career, Naoki Watanabe has worked with renowned companies such as Canon Anelva Corporation and Nikon Corporation. His experience in these organizations has allowed him to refine his expertise in sputtering technology and contribute to advancements in the field.

Collaborations

Watanabe has collaborated with notable individuals in his field, including David Djulianto Djayaprawira and Einstein Noel Abarra. These collaborations have further enriched his work and led to innovative solutions in sputtering technology.

Conclusion

Naoki Watanabe's contributions to sputtering technology have established him as a key figure in the industry. His innovative patents and collaborations reflect his commitment to advancing the field and improving deposition processes.

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