The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Dec. 18, 2014
Canon Anelva Corporation, Kawasaki-shi, JP;
Nobuo Yamaguchi, Kawasaki, JP;
Koji Tsunekawa, Kawasaki, JP;
Naoki Watanabe, Kawasaki, JP;
Motomu Kosuda, Kawasaki, JP;
CANON ANELVA CORPORATION, Kawasaki-Shi, JP;
Abstract
Disclosed is a sputtering apparatus having a target () disposed offset with respect to a substrate (), wherein the uniformity of a deposition amount can be ensured even when a substrate support holder () has a low number of rotations of several rotations to several tens of rotations and the amount of deposition is extremely small to provide such a film thickness of 1 nm or less. A control unit () is provided to control a rotational velocity V (rps) of the substrate support holder () to satisfy:by inputting the value of a deposition time T and the values of a total whole number of rotations N and a fractional number of rotations α which are expressed as:X=N+α