The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Sep. 29, 2009
Applicants:

Toru Kitada, Cupertino, CA (US);

Naoki Watanabe, Kawasaki, JP;

Motonobu Nagai, Tokyo, JP;

Masahiro Suenaga, Tokyo, JP;

Takeo Konno, Kawasaki, JP;

Inventors:

Toru Kitada, Cupertino, CA (US);

Naoki Watanabe, Kawasaki, JP;

Motonobu Nagai, Tokyo, JP;

Masahiro Suenaga, Tokyo, JP;

Takeo Konno, Kawasaki, JP;

Assignee:

Canon Anelva Corporation, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C25B 9/00 (2006.01); C25B 11/00 (2006.01); C25B 13/00 (2006.01); C23C 14/54 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H01F 41/18 (2006.01);
U.S. Cl.
CPC ...
C23C 14/542 (2013.01); C23C 14/3464 (2013.01); H01J 37/3266 (2013.01); H01J 37/32733 (2013.01); H01J 37/3405 (2013.01); H01J 37/3408 (2013.01); H01J 37/3414 (2013.01); H01F 41/18 (2013.01);
Abstract

A magnetic film having excellent uniformity in in-plane distribution of film thickness or sheet resistance is formed when the film is formed by forming a magnetic field on a processing surface of a substrate () and performing oblique incidence sputtering by using high discharge power. A sputtering apparatus () is provided with a substrate holder () for holding rotatably the substrate () in the surface direction of the processing surface of the substrate; a substrate magnetic field forming device () which is disposed to surround the substrate () and forms a magnetic field on the processing surface of the substrate (); cathodes () which are arranged diagonally above the substrate () and are supplied with electric discharge power; a position detecting device () for detecting a rotation position of the substrate (); and a control device () which adjusts the rotation speed of the substrate () in accordance with the rotation position detected by the position detecting device ().


Find Patent Forward Citations

Loading…