IDiyas

For the Inventor, By the Inventor

Fremont, CA, United States of America

Myoung-soo Jeon

USPTO Granted Patents = 11

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 169(Granted Patents)


Company Filing History:

goldMedal10 out of 33 
 
Silicon Bandwidth, Inc.
 patents
silverMedal1 out of 4 
 
Quantum Leap Packaging, Inc.
 patents

Years Active: 2003-2007

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11 patents (USPTO):Explore Patents
1. 7253365 - Die package for connection to a substrate (2007-08-07),
2. 7135768 - Hermetic seal (2006-11-14),
3. 7123465 - Decoupling capacitor for an integrated circuit and method of manufacturing thereof (2006-10-17),
4. 7070340 - High performance optoelectronic packaging assembly (2006-07-04),
5. 6905367 - Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same (2005-06-14),
6. 6847115 - Packaged semiconductor device for radio frequency shielding (2005-01-25),
7. 6803650 - Semiconductor die package having mesh power and ground planes (2004-10-12),
8. 6797882 - Die package for connection to a substrate (2004-09-28),
9. 6734546 - Micro grid array semiconductor die package (2004-05-11),
10. 6700138 - Modular semiconductor die package and method of manufacturing thereof (2004-03-02),
11. 6603193 - Semiconductor package (2003-08-05),

Title: The Innovative Mind of Myoung-soo Jeon

Introduction

Myoung-soo Jeon is a prominent inventor based in Fremont, California, known for his significant contributions to semiconductor technology. With 11 patents to his name, Jeon has demonstrated a remarkable ability to innovate and address complex challenges in the field.

Latest Patents

Among his latest inventions is a die package designed for connection to a substrate. This innovative die carrier holds a die, such as a microdisplay die, allowing for electrical connectivity by pressing the substrate against flexible, resilient leads of the die carrier. The housing and shroud structure enables the substrate to be inserted through a slot and engage with the leads, establishing a reliable electrical contact.

Another notable invention is the hermetic seal, which employs ultrasonically formed seals for semiconductor packages. This patent details methods of fabricating semiconductor packages that include a brittle center member, like glass, paired with a molded edge member. The edge member is ultrasonically welded to a body, allowing for a hermetically sealed package that includes precise features for accurate positioning and energy directors. The design incorporates pins with diverse lengths, enhancing functionality and adaptability in semiconductor devices.

Career Highlights

Jeon's impressive career includes tenures at Silicon Bandwidth, Inc. and Quantum Leap Packaging, Inc., where he honed his skills and contributed to cutting-edge projects in semiconductor technology. His work has significantly advanced the development of reliable and efficient semiconductor packaging solutions.

Collaborations

Throughout his career, Jeon has collaborated with skilled professionals, including Stanford W Crane, Jr. and Charley T Ogata. These partnerships have further enriched his inventive process, allowing for a blend of ideas and expertise that drive innovation forward.

Conclusion

Myoung-soo Jeon stands out as an influential inventor in the semiconductor industry, with a notable track record of successful patents and collaborations. His work not only exemplifies innovation but also paves the way for future advancements in technology. As he continues to push the boundaries of what is possible, Jeon's contributions will undoubtedly leave a lasting impact on the field.

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