The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Sep. 06, 2001
Stanford W. Crane, Jr., Santa Clara, CA (US);
Myoung-Soo Jeon, Fremont, CA (US);
Vicente D. Alcaria, Richmond, CA (US);
Silicon Bandwidth Inc., Fremont, CA (US);
Abstract
A semiconductor package having a molded body and a plurality of conductive pins that extend from the bottom of the molded body. The semiconductor package further includes a RF shield around a protected cavity that holds a first integrated circuit. The molded body can further include an unprotected plastic cavity for holding a second integrated circuit. The conductive pins form bonding pads that are used to electrically interconnect the first and second semiconductor devices to the external environment. A cover, beneficially comprised of copper, is disposed over the molded body. The plastic cavity beneficially includes a beveled wall that improves the routing of electrical conductors between the first integrated circuit and the second integrated circuit.