For the Inventor, By the Inventor

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Fremont, CA, United States of America

Silicon Bandwidth, Inc.

USPTO Granted Patents = 33

Forward Citations = 441

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26 inventors (with patents filed for the assignee):

Stanford W Crane, Jr (32 out of 66 patents)

Lakshminarasimha Krishnapura (13 out of 20 patents)

Myoung-soo Jeon (10 out of 11 patents)

4. Kevin J Link (6 out of 10 patents)

5. Maria M Portuondo (5 out of 25 patents)

6. Yun Li (5 out of 6 patents)

7. Arindum Dutta (5 out of 8 patents)

8. Moises Behar (4 out of 11 patents)

9. Zsolt Horvath (4 out of 4 patents)

10. Charley T Ogata (3 out of 17 patents)

11. Vicente D Alcaria (3 out of 3 patents)

12. Joshua G Nickel (2 out of 31 patents)

13. Josh Nickel (2 out of 10 patents)

14. Daniel Larcomb (2 out of 2 patents)

15. Bill Ahearn (2 out of 4 patents)

33 patents: Sort by Forward Citations

1. 7183646 - Semiconductor chip carrier affording a high-density external interface (2007-02-27),

2. 7135768 - Hermetic seal (2006-11-14),

3. 7123465 - Decoupling capacitor for an integrated circuit and method of manufacturing thereof (2006-10-17),

4. 7070340 - High performance optoelectronic packaging assembly (2006-07-04),

5. 6905367 - Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same (2005-06-14),

6. 6857173 - Apparatus for and method of manufacturing a semiconductor die carrier (2005-02-22),

7. 6847115 - Packaged semiconductor device for radio frequency shielding (2005-01-25),

8. 6828511 - Prefabricated semiconductor chip carrier (2004-12-07),

9. 6803650 - Semiconductor die package having mesh power and ground planes (2004-10-12),

10. 6797882 - Die package for connection to a substrate (2004-09-28),

11. 6734546 - Micro grid array semiconductor die package (2004-05-11),

12. 6709891 - Open-cavity semiconductor die package (2004-03-23),

13. 6700138 - Modular semiconductor die package and method of manufacturing thereof (2004-03-02),

14. 6679733 - Electrical connector having electrically conductive shielding (2004-01-20),

15. 6663294 - Optoelectronic packaging assembly (2003-12-16),

Silicon Bandwidth, Inc. is a technology company specializing in high-speed communications solutions. With expertise in semiconductor design and network infrastructure, Silicon Bandwidth delivers innovative products and services to enable faster and more efficient data transmission. Their solutions are utilized by companies across various industries, including telecommunications, data centers, and cloud computing.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

33 Patents

#57 in Fremont, CA

#2,381 in California

#9,947 in US

#19,554 in the World

Fremont, CA, United States of America

Silicon Bandwidth, Inc.

Forward Citations = 441

26 inventors:

Stanford W Crane, Jr (32 out of 66 patents)

Lakshminarasimha Krishnapura (13 out of 20 patents)

Myoung-soo Jeon (10 out of 11 patents)

4. Kevin J Link (6 out of 10 patents)

5. Maria M Portuondo (5 out of 25 patents)

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