For the Inventor, By the Inventor

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Fremont, CA, United States of America

Silicon Bandwidth, Inc.

USPTO Granted Patents = 33

% Expired Patents = 54.5

Forward Citations = 447

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26 inventors (with patents filed for the assignee):

Stanford W Crane, Jr (32 out of 66 patents)

Lakshminarasimha Krishnapura (13 out of 20 patents)

Myoung-soo Jeon (10 out of 11 patents)

4. Kevin J Link (6 out of 10 patents)

5. Maria M Portuondo (5 out of 25 patents)

6. Yun Li (5 out of 6 patents)

7. Arindum Dutta (5 out of 8 patents)

8. Moises Behar (4 out of 11 patents)

9. Zsolt Horvath (4 out of 4 patents)

10. Charley T Ogata (3 out of 17 patents)

11. Vicente D Alcaria (3 out of 3 patents)

12. Joshua G Nickel (2 out of 31 patents)

13. Josh Nickel (2 out of 10 patents)

14. Daniel Larcomb (2 out of 2 patents)

15. Bill Ahearn (2 out of 4 patents)

Core Competencies:

Semiconductor Packaging

High-Density Chip Carrier

Optoelectronic Assembly

Modular Interconnect

Decoupling Capacitor

Radio Frequency Shielding

Micro Grid Array

Electrical Connector

Multi-Chip Module

Hermetic Seal

Integrated Connector

Die Package

33 patents: Sort by Forward Citations

1. 7183646 - Semiconductor chip carrier affording a high-density external interface (2007-02-27),

2. 7135768 - Hermetic seal (2006-11-14),

3. 7123465 - Decoupling capacitor for an integrated circuit and method of manufacturing thereof (2006-10-17),

4. 7070340 - High performance optoelectronic packaging assembly (2006-07-04),

5. 6905367 - Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same (2005-06-14),

6. 6857173 - Apparatus for and method of manufacturing a semiconductor die carrier (2005-02-22),

7. 6847115 - Packaged semiconductor device for radio frequency shielding (2005-01-25),

8. 6828511 - Prefabricated semiconductor chip carrier (2004-12-07),

9. 6803650 - Semiconductor die package having mesh power and ground planes (2004-10-12),

10. 6797882 - Die package for connection to a substrate (2004-09-28),

11. 6734546 - Micro grid array semiconductor die package (2004-05-11),

12. 6709891 - Open-cavity semiconductor die package (2004-03-23),

13. 6700138 - Modular semiconductor die package and method of manufacturing thereof (2004-03-02),

14. 6679733 - Electrical connector having electrically conductive shielding (2004-01-20),

15. 6663294 - Optoelectronic packaging assembly (2003-12-16),

Company Overview

Silicon Bandwidth, Inc. is a technology company based in Fremont, California, specializing in advanced semiconductor solutions. The organization focuses on developing high-performance bandwidth management technologies that cater to various industries, including telecommunications and data centers. By leveraging innovative design and engineering practices, Silicon Bandwidth aims to enhance data transmission efficiency and optimize network performance, contributing to the evolving landscape of digital communication and connectivity.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

33 Patents

#65 in Fremont, CA

#2,462 in California

#10,309 in US

#20,162 in the World

Fremont, CA, United States of America

Silicon Bandwidth, Inc.

Forward Citations = 447

26 inventors:

Stanford W Crane, Jr (32 out of 66 patents)

Lakshminarasimha Krishnapura (13 out of 20 patents)

Myoung-soo Jeon (10 out of 11 patents)

4. Kevin J Link (6 out of 10 patents)

5. Maria M Portuondo (5 out of 25 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Silicon Bandwidth, Inc.. Retrieved from https://idiyas.com/company/silicon-bandwidth

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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