The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Feb. 25, 2002
Stanford W. Crane, Jr., Santa Clara, CA (US);
Jennifer Colegrove, Sunnyvale, CA (US);
Zsolt Horvath, Fremont, CA (US);
Myoung-soo Jeon, Fremont, CA (US);
Joshua Nickel, Santa Clara, CA (US);
Lei-Ming Yang, Fremont, CA (US);
Silicon Bandwidth, Inc., San Jose, CA (US);
Abstract
A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.