Lei-Ming Yang

Title: The Innovative Contributions of Lei-Ming Yang

Introduction

Lei-Ming Yang is a notable inventor based in Fremont, California. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the functionality of semiconductor die packages.

Latest Patents

One of Lei-Ming Yang's most recent patents is for a modular semiconductor die package and method of manufacturing thereof. This patent describes a modular semiconductor die package that includes a polymer base for mounting at least one semiconductor die. The design features a polymer cap that is operatively secured over the base, forming a cavity. The cap includes a light transmissive member that allows light of predetermined wavelengths to pass between the surface of the die and the light transmissive member. Additionally, a plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Career Highlights

Lei-Ming Yang is currently employed at Silicon Bandwidth, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of modular semiconductor packages, making them more efficient and versatile.

Collaborations

Throughout his career, Lei-Ming Yang has collaborated with several esteemed professionals in the industry, including Stanford W Crane, Jr. and Jennifer Colegrove. These collaborations have further enriched his work and contributed to the success of his innovations.

Conclusion

In summary, Lei-Ming Yang is a distinguished inventor whose contributions to semiconductor technology are noteworthy. His patent for a modular semiconductor die package exemplifies his innovative spirit and commitment to advancing the field.