The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2005

Filed:

Sep. 06, 2001
Applicants:

Stanford W. Crane, Jr., Santa Clara, CA (US);

Myoung-soo Jeon, Fremont, CA (US);

Vicente D. Alcaria, Richmond, CA (US);

Inventors:

Stanford W. Crane, Jr., Santa Clara, CA (US);

Myoung-Soo Jeon, Fremont, CA (US);

Vicente D. Alcaria, Richmond, CA (US);

Assignee:

Silicon Bandwidth Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 900 ; H01L 2904 ;
U.S. Cl.
CPC ...
Abstract

A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.


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