% Expired Patents = 50.0

Forward Citations = 68

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5 inventors (with patents filed for the assignee):

Michael A Zimmerman (2 out of 44 patents)

Stanford W Crane, Jr (2 out of 66 patents)

Charley T Ogata (1 out of 17 patents)

4. Maria M Portuondo (1 out of 25 patents)

5. Myoung-soo Jeon (1 out of 11 patents)

4 patents: Sort by Forward Citations

1. 7253365 - Die package for connection to a substrate (2007-08-07),

2. 7053299 - Flange for integrated circuit package (2006-05-30),

3. 6977432 - Prefabricated semiconductor chip carrier (2005-12-20),

4. 6867367 - Package for integrated circuit die (2005-03-15),

Quantum Leap Packaging, Inc. is a leading packaging solutions provider specializing in innovative and sustainable packaging solutions. With a focus on driving efficiency and reducing environmental impact, Quantum Leap Packaging offers a wide range of customizable packaging options for various industries. From design to delivery, our team is committed to exceeding customer expectations and delivering high-quality, cost-effective solutions.

Profile summary based on public USPTO records.