The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Jun. 29, 2004
Applicants:
Stanford W. Crane, Jr., Santa Clara, CA (US);
Myoung-soo Jeon, Fremont, CA (US);
Charley Takeshi Ogata, San Jose, CA (US);
Inventors:
Stanford W. Crane, Jr., Santa Clara, CA (US);
Myoung-soo Jeon, Fremont, CA (US);
Charley Takeshi Ogata, San Jose, CA (US);
Assignee:
Quantum Leap Packaging, Inc., Wilmington, MA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01R 13/502 (2006.01);
U.S. Cl.
CPC ...
Abstract
A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.