Ming-Tse Lin

Title: Inventor Profile: Ming-Tse Lin

Introduction

Ming-Tse Lin, an accomplished inventor based in Hsinchu, Taiwan, is recognized for his significant contributions to the semiconductor industry. With an impressive portfolio of 34 patents, Lin's work has greatly influenced the development of innovative technologies in semiconductor devices.

Latest Patents

Among Lin's recent patents are two notable inventions that demonstrate his expertise in semiconductor technology. The first patent relates to a structure of a semiconductor device, which includes a first circuit structure formed on a first substrate and a second circuit structure on a second substrate. This invention features unique test pads and bonding pads that enhance connectivity between circuit structures. The second patent presents a semiconductor structure incorporating an interposer substrate, which includes an electronic device, a guard ring, and a first redistribution layer. This layered approach allows for improved performance and reliability in electronic devices.

Career Highlights

Ming-Tse Lin has built a distinguished career at United Microelectronics Corporation (UMC), where he has been instrumental in advancing semiconductor technologies. His innovative designs and patent filings have positioned him as a key figure within the company and the broader semiconductor community.

Collaborations

Throughout his career, Lin has collaborated with talented colleagues, including Chun-Hung Chen and Yung-Chang Lin. These partnerships have allowed for a synergy of ideas and advancements in semiconductor research and development, further solidifying Lin's status as a prominent inventor in his field.

Conclusion

Ming-Tse Lin's dedication to innovation in the semiconductor industry is exemplified by his impressive patent portfolio and collaborations with other industry professionals. His work not only contributes to technological advancements but also serves as an inspiration for future inventors in the field of semiconductor technology.