The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Aug. 04, 2020
United Microelectronics Corp., Hsinchu, TW;
Zhirui Sheng, Singapore, SG;
Hui-Ling Chen, Kaohsiung, TW;
Chung-Hsing Kuo, Taipei, TW;
Chun-Ting Yeh, Taipei, TW;
Ming-Tse Lin, Hsinchu, TW;
Chien En Hsu, Singapore, SG;
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Abstract
A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.