Kaohsiung, Taiwan

Hui-Ling Chen

This inventor holds 18 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Technology. Top assignee: United Microelectronics Corp.. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui-Ling Chen. Retrieved from https://idiyas.com/inventor/hui-ling-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 3

Forward Citations = 36(Granted Patents)


Location History:

  • Kao-Hsiung Hsien, TW (2008 - 2016)
  • Kaohsiung, TW (2015 - 2024)

Company Filing History:


Years Active: 2008-2025

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Areas of Expertise:
Semiconductor Structure
Oxide Semiconductor
Field Effect Transistor
Device Manufacturing
Bonding Methods
Package Structure
Gate Structure
Die Seal Ring
Metal Structure
Semiconductor Wafer
Inductance Elements
18 patents (USPTO):Explore Patents

Title: Hui-Ling Chen: A Trailblazer in Semiconductor Innovations

Introduction

Hui-Ling Chen, based in Kaohsiung, Taiwan, is a notable figure in the field of semiconductor technology. With an impressive portfolio of 18 patents, Chen's work has significantly contributed to advancements in semiconductor structures and devices. His innovative designs focus on enhancing performance and efficiency in the ever-evolving semiconductor industry.

Latest Patents

Among Hui-Ling Chen's latest patents are several groundbreaking inventions. One such patent describes a semiconductor structure that includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. This design features an upper passive component pattern that exists opposite a lower passive component pattern. The hybrid bonding of interconnect structures facilitates the connection of these patterns, ultimately creating a sophisticated passive device.

Another recent patent outlines the structure of a semiconductor device that comprises a first circuit structure formed on a first substrate and a second circuit structure formed on a second substrate. With bonding pads for seamless connectivity, this design simplifies the arrangement of test pads, creating a more efficient semiconductor device.

Career Highlights

Hui-Ling Chen works at United Microelectronics Corporation, a leading player in the semiconductor industry. His extensive experience and innovative mindset have garnered him recognition as a key contributor to the company's technological advancements. Chen's expertise in integrating various components in semiconductor devices highlights his role in pushing the boundaries of semiconductor applications.

Collaborations

Throughout his career, Hui-Ling Chen has collaborated with esteemed colleagues such as Chien-Ming Lai and Yen-Chen Chen. These partnerships have fostered an environment of innovation, driving forward the creation of cutting-edge semiconductor solutions. Collaborating with talented individuals enhances the impact of Chen's work, ensuring that he remains at the forefront of technological advancements in this competitive field.

Conclusion

Hui-Ling Chen's contributions to semiconductor technology, exemplified by his 18 patents, reflect his dedication to innovation and excellence. His latest inventions demonstrate a commitment to enhancing semiconductor design and functionality. As he continues to work with United Microelectronics Corporation and collaborate with distinguished colleagues, the future of semiconductor technology looks promising under his influence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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