The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Jan. 27, 2021
United Microelectronics Corporation, Hsinchu, TW;
UNITED MICROELECTRONICS CORPORATION, Hsinchu, TW;
Abstract
A semiconductor structure in which the upper and lower semiconductor wafers are bonded by a hybrid bonding method is provided. The two semiconductor wafers each have discontinuous multiple metal traces or spiral coil-shaped metal traces. By hybrid bonding the two semiconductor wafers, multiple discontinuous metal traces are bonded together to form an inductance element with a continuous and non-intersecting path, or the two spiral coil-shaped metal traces are bonded together to form an inductance element. In this semiconductor structure, the inductance element formed by hybrid bonding has the advantage that the inductance value is easily adjusted.