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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ming-Chang Lee

This inventor holds 11 USPTO granted patents. Top assignees: National Tsing Hua University, Taiwan Semiconductor Manufacturing Comp. Ltd., National Applied Research Laboratories. Active years: 2013-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Chang Lee. Retrieved from https://idiyas.com/inventor/ming-chang-lee-aavz7s7z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11

% Patents Active = 54.5

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 525(Granted Patents)


Company Filing History:

goldMedal6 out of 1,308 
 
National Tsing Hua University
 patents
silverMedal3 out of 43,553 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
bronzeMedal2 out of 240 
 
National Applied Research Laboratories
 patents

Years Active: 2013-2018

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11 patents (USPTO):Explore Patents
1. 10090397 - Semiconductor device structure and method for forming the same (2018-10-02),
2. 10083959 - Semiconductor device structure and method for forming the same (2018-09-25),
3. 9748232 - Semiconductor device structure and method for forming the same (2017-08-29),
4. 9366817 - Method of integrating all active and passive optical devices on silicon-based integrated circuit (2016-06-14),
5. 9196483 - Carrier channel with element concentration gradient distribution and fabrication method thereof (2015-11-24),
6. 8846503 - Self-aligned and lateral-assembly method for integrating heterogeneous material structures on the same plane (2014-09-30),
7. 8805135 - Practical silicon photonic multi-function integrated-optic chip for fiber sensor applications (2014-08-12),
8. 8744222 - Practical silicon photonic multi-function integrated-optic chip for fiber sensor applications (2014-06-03),
9. 8536028 - Self alignment and assembly fabrication method for stacking multiple material layers (2013-09-17),
10. 8447152 - Waveguide coupling device with properties of forward and backward coupling as well as manufacturing method thereof (2013-05-21),
11. 8412007 - 3-D waveguide coupling device capable of two-step coupling and manufacture method thereof (2013-04-02),

Introduction

Ming-Chang Lee is a distinguished inventor based in Hsinchu, Taiwan, known for his advancements in semiconductor technology. With a total of 11 patents to his name, he has made significant contributions to the field of electronics, particularly in semiconductor device structures.

Latest Patents

Among his latest innovations is a patent focusing on a semiconductor device structure and a method for forming the same. This semiconductor device structure comprises a semiconductor substrate intricately designed with a gate stack positioned above it. The design includes spacers over the gate stack's sidewalls and protective layers crafted from differing materials strategically placed within the structure. Additionally, his patented method outlines the steps taken to form a gate along with multiple contact structures, surrounded by dielectric layers, enhancing functionality and efficiency.

Career Highlights

Ming-Chang Lee's career spans notable associations with premier institutions, such as National Tsing Hua University and Taiwan Semiconductor Manufacturing Company Ltd. His work not only showcases his expertise but also reflects his commitment to innovation in semiconductor technology.

Collaborations

Throughout his career, Lee has collaborated with esteemed professionals in the field, including Chih-Kuo Tseng and Chung-Tsun Sun. These partnerships have contributed to the development of groundbreaking technologies that propound advancements in electronic components.

Conclusion

Ming-Chang Lee stands out as a leading inventor whose patents underline his pivotal role in the semiconductor industry. His continuous dedication to innovation promises further advancements that could redefine electronic device structures in the years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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