The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Aug. 25, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ming-Chang Lee, Hsinchu, TW;

Chung-Tsun Sun, Hsinchu, TW;

Chia-Der Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 23/485 (2006.01); H01L 27/02 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 21/265 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/165 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); H01L 21/76895 (2013.01); H01L 23/485 (2013.01); H01L 27/0207 (2013.01); H01L 29/66545 (2013.01); H01L 29/66636 (2013.01); H01L 21/26506 (2013.01); H01L 21/28518 (2013.01); H01L 21/76831 (2013.01); H01L 21/76897 (2013.01); H01L 21/823475 (2013.01); H01L 29/165 (2013.01); H01L 29/665 (2013.01); H01L 29/7848 (2013.01);
Abstract

A method includes forming a gate, a first dielectric layer, a first contact structure, and a second contact structure over a substrate. The first contact structure and the second contact structure are over a source region and a drain region respectively. The first dielectric layer surrounds the gate, the first contact structure, and the second contact structure. The method includes forming a second dielectric layer over the first dielectric layer. The second dielectric layer has an opening exposing the gate, the first contact structure, and the second contact structure. A conductive layer is formed in the opening to electrically connect the gate to the first contact structure and the second contact structure.


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