The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jul. 27, 2011
Ming-chang Lee, Hsinchu, TW;
Ren-young Liu, Hsinchu, TW;
Ming-Chang Lee, Hsinchu, TW;
Ren-Young Liu, Hsinchu, TW;
Abstract
This patent disclosure is based on silicon instead of LiNbO, waveguide chip. The disclosed silicon-based multi-function integrated-optic chip comprises of unique design and fabrication features onto it. First, a unique polarization-diversity coupler is designed and fabricated to couple the external light into the silicon waveguide structure. Then TE mode is guided into a silicon slab waveguide, but TM mode is confined and diverted 90 degree in a silicon carbide structure till the chip edges for TM-mode suppression. Second, a unique two-step (vertical and lateral) taper waveguide region is designed and fabricated to bridge the polarization-diversity coupler output with the input of a multi-mode interferometer (MMI) splitter for power loss reduction. In this configuration, MMI may be a 1×2 or 2×2 structure to divide the input TE mode into a 50/50 splitting ratio output to form a Y-junction. Third, at either end of the Y-junction output, there is a phase modulator to achieve optical phase modulation through various physics mechanisms such as plasma dispersion, electro-optics, thermo-optics, or photo-elastic effect. With this newly-developed silicon-based multi-function integrated optic chip, the size and cost of fiber sensors including FOG's can be greatly reduced.