Chandler, AZ, United States of America

Mihir K Roy

This inventor holds 55 USPTO granted patents and 12 published patent applications and 2 EPO patents, primarily in High Density Interconnect (CPC class H01L). Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2012-2024.

USPTO Granted Patents = 55 

% Patents Active = 74.5

 

Average Co-Inventor Count = 3.0

ph-index = 8

Forward Citations = 228(Granted Patents)

Forward Citations (Not Self Cited) = 199(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:


Years Active: 2012-2024

Loading Chart...
Loading Chart...
Areas of Expertise:
High Density Interconnect
Organic Bridge Device
Microelectronic Packaging
Inductor Design
Substrate Conductor Structure
Chip Attach Techniques
Power Delivery
Embedded Traces
Circuit Board Formation
Solder Resist Layers
PTH Pad Reduction
Electrical Interconnect
55 patents (USPTO):Explore Patents

Title: Mihir K Roy: A Pioneer in High-Density Interconnect Technologies

Introduction

Mihir K Roy is a celebrated inventor based in Chandler, AZ, with an impressive portfolio of 55 patents to his name. His contributions to the field of microelectronics and interconnect technologies have significantly influenced modern electronic design and manufacturing processes.

Latest Patents

Mihir is known for his latest innovations, including the “High Density Interconnect Device and Method.” This invention describes embodiments that facilitate both high-density and low-density interconnection between microelectronic die and motherboards via Direct Chip Attach (DCA). In particular, it showcases microelectronic die with a high-density interconnect featuring a small bump pitch along one edge, and a lower density connection region with a larger bump pitch in other areas of the die. This technology ensures efficient interconnections using an interconnecting bridge made of materials like silicon, supporting high-density interconnect capabilities. Additionally, he holds a patent for the “High Density Organic Bridge Device and Method,” which enables multi-chip interconnections through organic bridges. This patent outlines organic package substrates with embedded organic bridges that connect die efficiently, further pushing the boundaries of integrated circuit design.

Career Highlights

Mihir K Roy has made remarkable strides in his career, notably working for renowned organizations such as Intel Corporation and Tahoe Research, Ltd. His tenure at these companies has allowed him to collaborate with other talented professionals and contribute to groundbreaking research and development in microelectronics.

Collaborations

Throughout his career, Mihir has worked closely with esteemed colleagues like Mathew J Manusharow and Wei-Lun Kane Jen. Their collaborations have fostered innovative ideas and helped advance the technologies that underpin many of today’s electronic systems.

Conclusion

Mihir K Roy stands out as a key figure in the realm of microelectronics, with a rich legacy of patents that emphasize his innovative spirit and commitment to advancing technology. His contributions continue to resonate within the industry, inspiring future generations of inventors and engineers.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to [email protected]
Loading…