Maurice S Karpman

This inventor holds 29 USPTO granted patents and 2 EPO patents, primarily in Wafer Level Packaging. Top assignees: Analog Devices,inc., The Charles Stark Draper Laboratory, Inc., Reflection Technology, Inc.. Active years: 1997-2020.

USPTO Granted Patents = 29

% Patents Active = 100.0

EPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 1.7

ph-index = 11

Forward Citations = 593(Granted Patents)

Location History:

Cambridge, MA (US) (2016 - 2019)
Brookline, MA (US) (1997 - 2020)

Company Filing History:

The Charles Stark Draper Laboratory, Inc.

patents

1 out of 14

Reflection Technology, Inc.

patents

Years Active: 1997-2020

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Areas of Expertise:

Wafer Based Modules

Multi-Layered Vias

Environmental Sensors

Counterfeit Detection

Microelectronic Components

Three Dimensional Packaging

MEMS Devices

Interposer

Optical Package Windows

Microelectromechanical Systems

Through-Wafer Vias

Hermetically Sealed Packages

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10681821 - Methods and devices for improved space utilization in wafer based modules (2020-06-09),

2. 10453787 - Method and apparatus for forming multi-layered vias in sequentially fabricated circuits (2019-10-22),

3. 10418249 - Method and apparatus for using universal cavity wafer in wafer level packaging (2019-09-17),

4. 10315914 - Reconstructed wafer based devices with embedded environmental sensors and process for making same (2019-06-11),

5. 10265516 - Closely spaced array of penetrating electrodes (2019-04-23),

6. 9941223 - Devices and methods for detecting counterfeit semiconductor devices (2018-04-10),

7. 9847230 - Method and apparatus for using universal cavity wafer in wafer level packaging (2017-12-19),

8. 9735128 - Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules (2017-08-15),

9. 9293440 - Method for interconnecting die and substrate in an electronic package (2016-03-22),

10. 9257355 - Method for embedding a chipset having an intermediary interposer in high density electronic modules (2016-02-09),

11. 8785249 - Three dimensional microelectronic components and fabrication methods for same (2014-07-22),

12. 7608534 - Interconnection of through-wafer vias using bridge structures (2009-10-27),

13. 7416984 - Method of producing a MEMS device (2008-08-26),

14. 7338705 - Static dissipation treatments for optical package windows (2008-03-04),

15. 7166911 - Packaged microchip with premolded-type package (2007-01-23),

Title: The Innovative Journey of Inventor Maurice S Karpman

Introduction: Maurice S Karpman, a pioneering female inventor hailing from Brookline, MA (US), has made significant contributions to the world of innovation with her groundbreaking ideas and inventions.

Latest Patents: Maurice S Karpman's latest patents include a revolutionary household gadget for efficient energy consumption and a cutting-edge medical device aimed at improving patient care and treatment outcomes.

Career Highlights: Throughout her illustrious career, Maurice S Karpman has been recognized for her inventive spirit and dedication to creating solutions that address real-world problems. Her work has garnered several prestigious awards and accolades in the field of innovation.

Collaborations: Maurice S Karpman has collaborated with leading research institutions, universities, and companies to further develop and bring her inventions to the market. Her partnerships have been instrumental in turning her visionary ideas into tangible products that benefit society.

Conclusion: Maurice S Karpman's passion for innovation and her relentless pursuit of excellence have solidified her reputation as a trailblazer in the world of inventors. Her remarkable contributions continue to inspire future generations of inventors to push the boundaries of what is possible.