The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Feb. 11, 2014
Applicant:
The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);
Inventor:
Maurice Karpman, Cambridge, MA (US);
Assignee:
THE CHARLES STARK DRAPER LABORATORY, INC., Cambridge, MA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/181 (2013.01);
Abstract
Techniques for constructing an electronic module are provided herein. For example, the techniques include orienting at least one die having a top side (e.g., a first side), a bottom side (e.g., a second side) and one or more side walls, on a substrate with the top side of the die proximate the substrate, coating the bottom side and each of the side walls of the die with a stress buffer material, forming a reconstructed wafer by encapsulating the coated die within a mold compound, and removing the substrate to expose the top side of the die.