The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

May. 20, 2016
Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventors:

Maurice S. Karpman, Brookline, MA (US);

Nicole S. Mueller, Cambridge, MA (US);

Gary B. Tepolt, Pelham, NH (US);

Russell Berman, Cambridge, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/147 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01);
Abstract

An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first layer deposited upon a substrate, a second layer deposited on a top surface of the first layer, and the via spanning multiple layers. The via can include a first bottom that is formed on a top surface of the first layer and a first sidewall that upstands from the first bottom and extending at least through the second layer.


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