The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Dec. 19, 2017
Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventors:

Maurice Karpman, Cambridge, MA (US);

Michael Rickley, Cambridge, MA (US);

Andrew Mueller, Cambridge, MA (US);

Nicole Mueller, Cambridge, MA (US);

Jeffrey Thompson, Cambridge, MA (US);

Charles Baab, Cambridge, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); H01L 23/13 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); B81B 7/0077 (2013.01); B81C 1/00825 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/5389 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); B81C 2203/0154 (2013.01); H01L 23/147 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.


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